Dry and Wet Etching

Semicon etching agents

High purity etching agents for silicon wafer etching and cleaning.

High performance along the value chain

From high purity process chemicals like etching liquids and etching gases to highly reliable component materials like vacuum sealants and long-life tubes, couplings and valves, Daikin provides high-performance materials along the semiconductor manufacturing value chain reliably for more than 20 years.

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Silicon wafer etching and cleaning

Daikin supplies high purity etching agents for the most advanced processes on a global scale. We offer high-purity wet etchants that greatly reduce impurities such as metal ions and particles. Daikin‘s proprietary surfactant, containing buffered hydrofluoric acid (BHF-U), reduces particle adhesion on silicon wafers and also prevents surface roughness.

Etching gases

All steps of dry etchant production, from raw materials to the refinement stage, are integrated in the Daikin Group. Our dry etching gases feature a purity of more than 99.999%, and can be used in high-precision etching processes.

All products have a high purity of > 99.999 % and can be used for etching, cleaning.

  • CF4
  • CHF3
  • CH2F2
  • COS
  • C3F6
  • C4F8
ProductCharacteristicsApplication
Hydrofluoric acid (HF)
(high purity: 50%, 49%, etc)
High quality and low impurities (metal content)Etching agent, cleaning agent, etc.
Ammonium fluoride (NH4F)Buffered hydrofluoric acid raw material, detergent
Buffered fluoric acid (BHF)Etching agent, cleaning agent, etc.
Buffered Fluoric Acid with surfactant (BHF-U)High permeability and refinementEtching agent, cleaning agent, etc.

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